Wafer wire bonder

Commodity a leaf — nothing below it, 3 links to KBLI

Level: Commodity
Parent: 23211100
Below: 0
Links · KBLI: 3

Definition

UNSPSC 23211103

A machine that is connected to the chip pad and the lead frame to link the chip attached on the paddle of the lead frame and the lead frame electrically as the die bonding process in semiconductor assembly process.

Same parent

Under 23211100 · 6

23211101 Semiconductor process systems Commodity 23211102 Printed circuit board making system Commodity 23211103 Wafer wire bonder You are here 23211104 Semiconductor chip inspection monitor Commodity 23211105 Vacuum impregnation or porosity sealing device Commodity 23211106 Ion implanter Commodity

Activities that produce or sell this

KBLI · 3

Inherited from family 23210000.

28299 Industri Mesin Keperluan Khusus Lainnya YTDL Sub-class 46591 Perdagangan Besar Mesin Kantor dan Industri Pengolahan, Suku Cadang, dan Perlengkapannya Sub-class 46902 Perdagangan Besar Berbagai Macam Barang Selain di Grosir/Perkulakan Swalayan Sub-class

Warning
The links were generated with a large language model (Gemini 3.5 Flash), matching UNSPSC at the family level to KBLI at the kelompok level. Some of them maybe are wrong, so check any link you intend to rely on.